Teledyne Days Room 1-Semiconductor Inspection at Speed

Date

Thursday, April 16, 2026

Time

10:30 AM Europe/Berlin

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Agenda

Semiconductor Inspection at Speed

The semiconductor market is growing fast - and so is the need for inspection. Learn about the products and technologies that have made Teledyne the global leader for these inspections, from wafer and die-stacking to packaging and populated circuits, using UV or SWIR illumination to detect the invisible, enabling the speed and efficiency required for this highly competitive market.

Dale Deering

VP Product Marketing & LineScan Product Management, Teledyne Imaging

Over 25 years in machine vision spanning development and business leadership. Dale oversees product and business development for machine vision cameras at Teledyne, with deep expertise in high-speed and line-scan imaging applications. He serves on the A3 Vision & Imaging Technology Strategy Board.

Danny Hesse

Portfolio Manager, STEMMER IMAGING

STEMMER IMAGING AG

LEADING VISION

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